Israeli chip startup MultiPhy raises $17m

startup app

The Ness Ziona company develops DSP-based high bandwidth CMOS communications semiconductors.

Israeli chip developer MultiPhy Inc. has completed a financing round of $17 million from existing and new investors, including both venture capitalists and major strategic corporate leaders. The Ness Ziona company develops DSP-based high bandwidth CMOS communications semiconductors for Data Center Connectivity.

MultiPhy CEO Avi Shabtai said, “The commitment and support of our investors sends a clear message that MultiPhy is the leading player in high speed 100G single lambda Data Center connectivity. As the market sets clear demand for significant increase in throughput connectivity and cost effectiveness, we expect single lambda 100G modules to become the mainstream with millions of ports deployed worldwide.”

The new capital gives the company additional resources and tools to accelerate development of its next-generation FlexPhy IC and drive the adoption of its technology through strategic partnerships. The funding will also allow MultiPhy to expand its business operations to better support customers and strengthen the company’s leadership in the market.

Multiphy was founded in 2006 in the Maayan Ventures Incubator and graduated from it in 2008.

Published by Globes [online], Israel business news - www.globes-online.com - on January 12, 2016

© Copyright of Globes Publisher Itonut (1983) Ltd. 2016

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