The device will help customers halve the size of dies for AC to DC converters, required in fast growing applications such as LED lighting.
Specialty foundry Tower Semiconductor Ltd. (Nasdaq: TSEM; TASE: TSEM) has unveiled a 17 ohm mm^2 750V device, which will help customers halve the size of dies for AC to DC converters, required in fast growing applications such as LED lighting. Tower is presenting innovation and the entire power management platform at the 25th International Symposium on Power Semiconductor Devices in Kanazawa, Japan.
Tower estimates that the market for power management integrated circuits in AC to DC applications will grow 6.3% over the next five years, and that LED applications are the fastest growing market segment with 56% growth over the next five years. It adds that the new technology enables a cost advantage for customers building next-generation ICs for AC to DC converters in applications such as power supplies and LED lights. The technology integrates on the production 700V process which is today the most streamlined in the industry, requiring only 16 masking layers for a two layer metal process. The new technology does not add masking layers, preserving this significant advantage over other solutions while reducing on-resistance and shrinking die size significantly."
Published by Globes [online], Israel business news - www.globes-online.com - on May 28, 2013
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